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Innovations in Data Center Cooling: Balancing Energy Efficiency with Increased Processing Power

21 Sep 2023 | IN-7072

Purdue University received a substantial grant from the U.S. Department of Energy's COOLERCHIPS program to advance its efforts in developing efficient data center cooling solutions, driven by the increasing demand for such solutions in the face of increasing data center power density and energy consumption. In response to this demand, innovations like direct-to-chip cooling and immersion cooling are emerging as crucial methods to enhance energy efficiency, impacting data center operators and smart building technology providers. These advancements aim to reduce overall Power Usage Effectiveness (PUE), addressing the critical need for more sustainable and cost-effective data center cooling.
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