RELATED SERVICE:
5G, 6G & Open RAN
Actionable Benefits
- Determine key trends and challenges in 5G and future Radio Access Network (RAN) semiconductor market.
- Assist the mobile industry in making decisions for Open RAN deployments.
- Identify the processing requirements for Massive Multiple Input, Multiple Output (mMIMO) and the need for hardware acceleration.
- Key recommendations to accelerate chipset development for future RANs.
Research Highlights
- Detailed description of RAN protocol stack and semiconductors.
- Detailed overview of the types of semiconductors available for RAN processing, including Layers 1, 2, and 3 (traditional RAN, and Open RAN).
Critical Questions Answered
- What are the major challenges related to large-scale mMIMO deployments?
- How can Commercial-Off-the-Shelf (COTs) hardware, in combination with accelerator cards, fulfill the RAN processing demands for Open RAN?
- What are the most recent developments related to chipsets for Open RAN?
Who Should Read This?
- Decision makers for mobile networks who need to understand the role of semiconductors in RANs.
- Open RAN vendors and service providers.
- Chipset vendors.
- Innovation leaders who need to understand the role of semiconductors in future 5G deployments.
Companies Mentioned
